Looks good! Possibly the SOIC chips could do with a little less solder. But as long as the joints are solid on the pads, all good! I find 595 chips and inverters pretty tough 🙂.
If I want to be sure about a blobby pad, sometimes I would push the iron at quite a low angle without adding more solder, so pushing the solder towards the IC body. This tends to form a nice fillet and as long as there isn’t too much on there shouldn’t bridge.